craigjb

6 ms·

1.
by craigjb 2mo ago
We’re at approximately where PCB pricing was 20 years ago, which _is_ a big deal: https://wafer.space
2.
Worker shortage endangers US chip production plans(taipeitimes.com)
3 points by craigjb 2mo ago|0 comments
3.
by craigjb 3mo ago
Apple has not shipped an InFO-PoP with side-by-side integrated die yet. This is expected to be the first one, using RDLs for the die-to-die interconnect (so different than M-Ultra series that uses silicon bridges).
4.
by craigjb 3mo ago
Applied Materials, Lam Research, and KLA are all U.S. companies. ASML supplies lithography, but hundreds of other tools come from these companies.
5.
by craigjb 3mo ago
The terms to search for are fan-out wafer level packaging (FOWLP) and TSMC InFO. The chiplets come from different wafers and are reconstituted into a molded plastic wafer, allowing multiple die side-by-side. Then multiple layers of wires a
6.
by craigjb 1y ago
7nm for Achronix https://www.achronix.com/product/speedster7t-fpgas
7.
Tough New U.S. Controls on China May Miss Target(eetimes.com)
5 points by craigjb 2y ago|0 comments
8.
Intel 3 Represents an Intel Foundry Milestone(eetimes.com)
40 points by craigjb 2y ago|7 comments
9.
ASML dethrones Applied Materials, becomes largest fab tool maker(tomshardware.com)
275 points by craigjb 3y ago|125 comments
10.
US’ chip bid ‘futile,’ Morris Chang says (TSMC co-founder)(taipeitimes.com)
1 points by craigjb 4y ago|0 comments
11.
Samsung Electronics cultural issues causing disasters in foundry, LSI, DRAM(semianalysis.substack.com)
343 points by craigjb 4y ago|221 comments
12.
Intel to buy Tower Semiconductor for $5.4B(cnbc.com)
1 points by craigjb 5y ago|0 comments
13.
How to Interpret Chip Supply Chain Data(eetimes.com)
1 points by craigjb 5y ago|0 comments
14.
Compute vs. Hardware(tellusim.com)
38 points by craigjb 5y ago|3 comments
15.
Compute versus Hardware(tellusim.com)
18 points by craigjb 5y ago|2 comments
16.
Intel Brings Chiplets to Data Center CPUs(eetimes.com)
49 points by craigjb 5y ago|50 comments
17.
by craigjb 5y ago
Equipment for ion implantation already includes mini accelerators [1] [2]. The semiconductor equipment industry in general has many machines that feel like they came out of a physics lab into a semi fab. For example, plasma dry-etching or d
18.
by craigjb 5y ago
You also need hundreds of other machines from Applied Materials, KLA Tencor, Lam Research, Tokyo Electron, etc. Then, years of process development R&D: what temperature do we bake this layer at, how long, what profile, what atmosphere i
19.
Bonkers Cyclocopter Flies in a Unusual Way(hackster.io)
41 points by craigjb 5y ago|12 comments
20.
by craigjb 5y ago
You are absolutely correct that design costs swamp mask costs by far. For 7 nm, it costs more than $271 million for design alone (EDA, verification, synthesis, layout, sign-off, etc) [1], and that’s a cheaper one. Industry reports say $650-
21.
by craigjb 5y ago
I built the Gameslab around this concept, but haven’t worked on it much lately. https://craigjb.com/2019/11/26/gameslab-overview/
22.
US, Europe 'unrealistic' in fab expansion drive, says TSMC chair(digitimes.com)
39 points by craigjb 5y ago|65 comments
23.
by craigjb 5y ago
Keep in mind, a semiconductor fab has hundreds of other machines and equipment involved, and US companies are some of the biggest suppliers (Applied Materials, Lam Research, KLA-Tencor--all multi-billion dollar companies). Lithography is de
24.
by craigjb 5y ago
TSMC's plans for Arizona have been increased to start with 100k per month with future phases up to 200k [1] [1] https://technosports.co.in/2021/03/03/tsmc-to-build-5nm-plan...
25.
Suez Canal Blocked After Container Ship Gets Stuck(nytimes.com)
1 points by craigjb 5y ago|0 comments
26.
by craigjb 6y ago
The ASML lithography machine is just one, very important, machine out of many dozens. A semiconductor fab process involves 100s-1000s of process steps each with dozens to hundreds of parameters. For example, something as simple as rinsing a
27.
by craigjb 6y ago
Microchip has the product for you then! Well, the RiscV part anyway. https://www.microsemi.com/product-directory/soc-fpgas/5498-p...
28.
AMD Patent Reveals Hybrid CPU-FPGA Design That Could Be Enabled by Xilinx Tech(hothardware.com)
278 points by craigjb 6y ago|155 comments
29.
Linux on an 8-Bit Micro? (2012)(dmitry.gr)
92 points by craigjb 6y ago|25 comments
30.
by craigjb 6y ago
The biggest impact for me I think is the lack of ability to export STEP for KiCad 3D models.

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