FastFT

8 ms·

1.
by FastFT 9mo ago
They (GF) do not make DRAM. They might have an eDRAM process inherited from IBM, but it would not be competitive. You’re correct that DRAM is a very specialized process. The bit cell capacitors are a trench type that is uncommon in the gene
2.
by FastFT 10mo ago
There are no large scale pure play DRAM fabs that I’m aware of, so Apple is (more or less) buying from the same 3 companies as everyone else.
3.
by FastFT 2y ago
Both cases occur in industry. The parts that only go through additional testing (radiation lot acceptance testing aka RLAT) are commonly sold as “radiation tolerant”. Parts that undergo hardening via design/manufacturing changes are of
4.
by FastFT 2y ago
Not a developer in the field, but I believe generally the HLSL isn’t packaged in the game. Instead an intermediate format called DXIL is produced at build time from the HLSL, and that’s what is packaged.
5.
by FastFT 2y ago
Not sure if its from Quickturn’s acquisition, but Cadence still makes a hardware simulation platform called Palladium.
6.
by FastFT 3y ago
Couple of likely reasons: 1. Process limitations (no high voltage devices, poor analog characteristics, limited resistor choice, etc) 2. The skill set for power device/analog IC design is very different than digital design (and harder
7.
by FastFT 3y ago
Core voltage is going to be in the ballpark of 1V, and given the stated power consumption is 15kw that means a minimum of 15kA. So, it is indeed a lot but the math checks out.
8.
by FastFT 3y ago
Hardware compatible doesn’t mean very much in this case. It’s a different ISA so you’ll need a different tool chain and recompilation (possibly rewrite given that assembly is very common in deeply embedded processors). It’ll also have diffe
9.
by FastFT 3y ago
High end NICs like Mellanox ConnectX are probably more similar to the 82586 in terms of breadth of functionality. They have (R)DMA, hardware timestamping, encryption, etc. Although, I wouldn’t expect to see much hand crafted logic design ou