4 ms·

I'm making an educated guess but probably the cutting of chips from the wafers, placing them into the appropriate ceramic socket types (DIP, BFGA, SMD etc), sol

I'm making an educated guess but probably the cutting of chips from the wafers, placing them into the appropriate ceramic socket types (DIP, BFGA, SMD etc), soldering the line wires from chip to pin, encasing the chip, etc.

a1o 2y ago
> DIP I am happily imagining opening a recent Apple device and seeing 74 gates with through holes in green PCBs, with an Apple logo made in soldering lead marking in the corner of the board.