8 ms·
IMO, dicing counts as part of packaging. So before the dicing step of packaging.
by phire 1mo ago
IMO, dicing counts as part of packaging. So before the dicing step of packaging.
- gaigalas 1mo agoEach die on the wafer is kind of different. Light is not all the same, usually dies on the center of the wafer are better and it gets worse as you move outside. That plays out in binning, and it involves even design (laying out dies on the wafer such as the imperfections produce still usable ones, perhaps with some stuff disabled or running on lower specs). So, there is some sort of QA at that point (seeing how bad the bad dies are), which also feeds into adjusting following batches. DDR5 is already more complicated at that step. As I mentioned, it has ECC on the die and all other sorts of complications. A clean reuse of a DDR4 process seems unfeasible. There's significant investment needed for DDR5 even for what you consider "dicing".