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Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory)
by oxw 10mo ago
Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory). Wonder if this is something DARPA is trying to solve here.
- Sabinus 10mo agoTFA did mention associated microfluid cooling research.