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Silicon Valley chip startup raises $100M to take on TSMC and ASML
- tromp 11mo agoASML must have done extensive research on X-ray based lithography, before deciding that EUV is the better option to pursue, despite the huge technological hurdles the latter entails. Why would the trade-offs look different for Substrate? Have they overcome some huge hurdle for X-ray that ASML deemed infeasible?