6 ms·
a second heatsink mounted the back of the chip? maybe the socket the chip in suck a way the back touches a copper plate attached to some heatpipes? plenty of op
by berbec 1y ago
a second heatsink mounted the back of the chip? maybe the socket the chip in suck a way the back touches a copper plate attached to some heatpipes? plenty of options
- BizarroLand 1y agoI mean, there's no real reason a chip has to be a wafer. A toroidal shape would allow more interconnects to be interspaced throughout the design as well as more heat-transfer points alongside the data transfer interconnects. Something like chiplet design where each logical section is a complete core or even an SOC with a robust interconnect to the next and previous section. If that were feasible, you could build it onto a hollow tube structure so that heat could be piped out from all sides once you sandwich the chip in a wraparound cooler. I guess the idea is more scifi than anything, though. I doubt anyone other than ARM or RISC-V would ever even consider the idea until some other competitor proves the value.